Wednesday, 4 May 2022

Synthesis, Characterization and Optimization of Electrophoretic Deposition (EPD) Parameters of YSZ Layer on Ti-6Al-4V Alloy substrate: A Recent Study | Chapter 06 | Recent Trends in Chemical and Material Sciences Vol. 8

 The purpose of this study is to see how different EPD parameters (voltage, duration, and concentration) affect the thickness, porosity, and coating characterizations of a YSZ layer on a Ti-6Al-4V alloy substrate while utilising DC current. To determine the optimal conditions for EPD, the Taguchi method was utilised, and several criteria were applied to deposit biological coatings. Yttria stabilised zirconia powder (YSZ) was electrophoretically coated on Ti-6Al-4V alloy substrate using ethanol as a solvent under DC to improve the alloy surface quality and match the requirements of biological orthopaedic application activity. Ethanol was utilised as a solvent to precipitate chitosan and YSZ on the metal substrate. The surface composition and cross section of coatings have been reported using electrode-enabled cathodic deposition for characterisation. To characterise the surface morphology of the YSZ layer, a variety of tests and inspections were carried out, including zeta potential, water contact angle, XRD, SEM, and optical microscopes. 40 volts, 2 minutes, and 1 g/l suspension at room temperature were the optimal conditions for YSZ layer deposition. The contact angles of the coatings were varied between hydrophilic 67.489C and hydrophobic 35.914 C. With pores ranging in size from 56.601 to 83.505 m, appropriate percentages of porosity were attained.


Author(S) Details

Ayad Naseef Jasim
Department of Materials Engineering, College of Engineering, University of Diyala, Iraq.

Muna khethier Abbass
Department of Production Engineering and Metallurgy, University of Technology, Baghdad, Iraq.

Mohammed Jasim
Department of Production Engineering and Metallurgy, University of Technology, Baghdad, Iraq.

Khawla Salah
Application Science Departments, University of Technology, Iraq.

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