Experimental Analysis of SnS:Cu Thin Films Obtained by USP for their Implementation in Solar Cells Simulated by SCAPS| Chapter 3 | Research Developments in Science and Technology Vol. 3

The ultrasonic spray pyrolysis (USP) process was used to make thin films of tin sulphide (SnS) doped with copper (SnS:Cu). Doping concentrations "y" (y = [Cu]/[Sn]) of 0 (no doping sample), 2, 5, and 10% have been proposed. The structural, morphological, chemical, optical, and electrical characteristics of the thin films were investigated utilising a variety of methods. The undoped sample has an orthorhombic structure, whereas the doped thin films have a cubic structure, according to X-ray diffraction (XRD). The inclusion of the dopant substance Cu may have caused a change in unit cell size, according to Raman spectroscopy. When y is raised, scanning electron microscopy (SEM) indicates an increase in grain density. The optical bandgap was determined by studying the transmittance and reflectance of the films using the UV-VIS spectroscopic method. The bandgap for the sample at y = 0% was found to be 3.51 eV, and this value rises for the doped samples as the parameter y increases. When the doping % is raised, the Hall–Van der Pauw approach shows an increase in carrier concentration and mobility but a decrease in resistivity.

Using the 1-dimensional SCAPS tool, the acquired experimental data was used to numerically simulate the material and its influence on a solar cell in order to replicate the material and its impact. To test the performance, several SnS:Cu doped absorber layers were proposed as absorber layers inside the solar device. The effect of SnS:Cu thickness on cell efficiency was debated.

Author(s) Details:

Sergio Rodríguez-Castro,
Tecnológico Nacional de México/Instituto Tecnológico de la Laguna, Torreón 27000, Coahuila, México.

Carlos Álvarez-Macías,
Tecnológico Nacional de México/Instituto Tecnológico de la Laguna, Torreón 27000, Coahuila, México.

Lizbeth Salgado-Conrado,
Facultad de Ingeniería Mecánica y Eléctrica, Universidad Autónoma de Coahuila, Torreón 27276, Coahuila, México.

Indira J. Ruiz-Heredia,
Facultad de Ingeniería Mecánica y Eléctrica, Universidad Autónoma de Coahuila, Torreón 27276, Coahuila, México.

Please see the link here: https://stm.bookpi.org/RDST-V3/article/view/6628