Thickness control and consistency optimization of the photoresist all the while the photolithography process are thought to be main topics for process engineers to include due to the accuracy and sizing necessities of popular semiconductor devices contemporary. In the Integrated Nanosystems Research Facility at the California Institute for Telecommunications and Information Technology (Calit2), 8 silicon wafers were coated accompanying a positive photoresist chosen Shipley 1827 in a systematic way to boost uniformity and density during alone step photolithography. In this paper, the parameters affecting photoresist width are thoroughly resolved and an economic and novel approach reconstructing uniformity and diameter is presented. First, peeling off is usually observed all along developing processes and it maybe minimized by adding HMDS to advance adhesion. Second, all drain lids are sealed to control the air flow. Finally, ray of light beam check and edge distance measurement are acted to properly position the wafer. The author further discusses various other essential but surely ignored factors that can influence the uniformity and denseness of the photoresist, such as recoating, bubbles, thus. By following this approach, high quality distinct-layer silicon wafer maybe coated calm.
Author(s) Details:
Junyang Zhang,
University of California, Irvine, United States.
Please see the link here: https://stm.bookpi.org/FRAPS-V2/article/view/10149
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