To machine "difficult-to-cut" materials including
ceramics, glass, and silicon wafers, a hybrid and widely recognized process
known as electrochemical discharge machining (ECDM) is used. It employs the
working principle of electrochemical machining (ECM) and electric-discharge
machining (EDM) processes to remove the material by combining chemical etching
with thermal melting. The materials machined using ECDM exhibits enormous
implementations in the field of MEMS and lab-on-chip. Different facets of the ECDM
process have been researched in an effort to escalate its effectiveness ever
since it was originally shown. The present chapter discusses the critical
research potentials of the ECDM process that was documented in the past
decades. Additionally, it covers the impact of several input process factors,
including electrical, electrolyte, and tool electrode, on ECDM performance. A
summarized report on ECDM hybridization, and variants are also given in a lucid
manner. It also identifies future directions that might enhance the ECDM
process's overall machining performance. It is concluded that with the help of
gas film dynamics controlled by variables such as electrolyte characteristics
and tool motions, ECDM can machine non-conductive materials with precision. Pulsed
voltage, suggested electrolytes (NaOH, KOH), and regulated tool properties
(material, shape, and rotation) are important factors. Spherical tool
electrodes help minimize overcut and taper comparative to other tools while
machining depth and geometrical accuracies can be further improved by
implementing hybridization such as magnetic assistance & ultrasonic
assistance.
Author(s) Details:
Sahil Grover,
Mechanical Engineering Department, Punjab Engineering College,
Chandigarh, India.
Viveksheel Rajput,
Mechanical
Engineering Department, Punjab Engineering College, Chandigarh, India.
Vikas Yadav,
Mechanical Engineering Department, Punjab Engineering College,
Chandigarh, India.
Sanjay Kumar Mangal,
Mechanical Engineering Department, Punjab Engineering College,
Chandigarh, India.
Sarbjit Singh,
Mechanical Engineering Department, Punjab Engineering College,
Chandigarh, India.
Sanjeev Kumar,
Mechanical
Engineering Department, Punjab Engineering College, Chandigarh, India.
Please see the link here: https://stm.bookpi.org/TAER-V5/article/view/13292
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