Investigating the Use for Solderless Assembly for Electronics of Some Electrically Conductive Composite Materials | Chapter 13 | Recent Progress in Science and Technology Vol. 8

 Solderless congregation for electronics is a new paradigm proposed to solve the questions resulting from contradictory modern trends: the ban of the lead apiece EU RoHS Directive led to an increase of the energy devouring and cost of the electronic products, but to a depravity of reliability; therefore, an increase in wastes that comes in contradiction accompanying the depletion of materials for the transistors industry. The increase standard for electronic products on account of an expanding IoT manufacturing requires increased dependability. In a particular approach that tried expected both plain, i.e. using generally existing photoelectric assembly line equipment, and causing trouble, i.e. manufacturing the complete assembled photoelectric module in one point, it turned out that new materials were wanted. Another electrically conductive substance is wanted to avoid the electrochemical process of copper dethroning. The paper describes the judgments of a study on two electrically conductive composite materials, as well as a procedure for qualifying them for use in the result of solderless electronic modules worthy handling ultra extreme-frequency and cook signals. A practical solution search out compare the frequency demeanor of two identical test forms, one made apiece electrically conductive composite material, and the other by copper. The approximate analysis told that electrically conductive adhesives perform marginally better at high recurrences than copper in terms of insert loss and return loss in the range of 0 to 10 GHz; the sticking is a good substitute for fasten alloy to connect temperature-impressionable components operating at wave between audio and infrared.

Author(s) Details:

Gaudentiu Varzaru,
Syswin Solutions, 26 Biharia Str., 3rd Floor, 013981, Sector 1, Bucharest, Romania.

Mihai Savu,
Samway Electronic, 16 Maltopol Str, 011048, Sector 1, Bucharest, Romania.

Bogdan Mihailescu,
Center for Electronic Technology and Interconnection Techniques, University Politehnica of Bucharest, 1-3 Iuliu Maniu Blvd, Sector 6, 061071, Bucharest, Romania.

Ciprian Ionescu,
Center for Electronic Technology and Interconnection Techniques, University Politehnica of Bucharest, 1-3 Iuliu Maniu Blvd, Sector 6, 061071, Bucharest, Romania.

Mihai Branzei,
Research and Expertise Center for Special Materials, University Politehnica of Bucharest, 313 Spl. Independentei, Sector 6, 060042 Bucharest, Romania.

Please see the link here: https://stm.bookpi.org/RPST-V8/article/view/10106